Solutions
Constant Temperature Test
Temperature & Humidity Test
Degrees of Protection (IP Code)
Thermal Shock Test
Altitude Test
Solderability Test
Adhesion Test
Colour Assessment Test
ESD Analysis (RTG & Walking Test)
Non-Destructive Test
Destructive Test
Supply of Environmental Chamber
Preventive Maintenance Services
Material Sorting Activities
Chamber Repair Services
Chemical De-capsulation
Decapsulation is a method to expose the internal part of the component by chemical methods for IC and BGA component or by mechanical method for the hermetic known as delidding or decapping.
Upon completion of the Decap, the samples are being able to inspect for any evidence of defect or damage on die or wire structure. The inspection later will provide the root cause of the failure or defect based on the evidence seen on the sample itself.
Below are the images of the decap sample:
