RFAL TECHNOLOGY PRIVATE LIMITED (INDIA)

BGA & PCBA Rework / Repair

Ball grid arrays assist in achieving precision and providing additional space on the board for efficient and accurate component mounting. With advancing technology, there is a growing need for PCBs to shrink in size while maintaining consistent results and quality. The precise mounting of components on PCBs is paramount, achievable through either through-hole technology or surface mounting.

Procedure for Re-balling Ball Grid Arrays (BGAs) & Micro BGAsBGA

Step 1:
INCOMING DAMAGED BGA
  • Solder ball removal
  • Visual Inspection
Step 2:
REMOVE SOLDERS
  • Cleaning
  • Bake for 2 hours
  • Flux printing & Re-balling
Step 3:
AFTER RE-BALLING
  • Re-flow process
  • QA Inspection
  • All tests to follow IPC Standard

PCBA Rework Capability

  • Lifted pads
  • BGA rework (Removal & Attachment)
  • Broken trace (Add / Remove trace)
  • Edge damage
  • Oxidization treatment (Component & PCB)
  • Masking
  • Eyelet rework
  • Warpage
  • Delamination
  • Gold plating
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