
BGA & PCBA Rework / Repair

Ball grid arrays assist in achieving precision and providing additional space on the board for efficient and accurate component mounting. With advancing technology, there is a growing need for PCBs to shrink in size while maintaining consistent results and quality. The precise mounting of components on PCBs is paramount, achievable through either through-hole technology or surface mounting.
Procedure for Re-balling Ball Grid Arrays (BGAs) & Micro BGAsBGA

Step 1:
INCOMING DAMAGED BGA
- Solder ball removal
- Visual Inspection

Step 2:
REMOVE SOLDERS
- Cleaning
- Bake for 2 hours
- Flux printing & Re-balling

Step 3:
AFTER RE-BALLING
- Re-flow process
- QA Inspection
- All tests to follow IPC Standard
PCBA Rework Capability
- Lifted pads
- BGA rework (Removal & Attachment)
- Broken trace (Add / Remove trace)
- Edge damage
- Oxidization treatment (Component & PCB)
- Masking
- Eyelet rework
- Warpage
- Delamination
- Gold plating