Solutions
Constant Temperature Test
Temperature & Humidity Test
Degrees of Protection (IP Code)
Thermal Shock Test
Altitude Test
Solderability Test
Adhesion Test
Colour Assessment Test
ESD Analysis (RTG & Walking Test)
Non-Destructive Test
Destructive Test
Supply of Environmental Chamber
Preventive Maintenance Services
Material Sorting Activities
Chamber Repair Services
Dye and Pry Analysis
Dye and Pry Testing applied to the component for the purpose to check for the any sign of micro crack on the solder joint especially for the BGA, Leadless such as QFN and others SMT product. The sample will be place on the vacuum environment in order to get the Dye to penetrate on the pre-existing crack if there is. By doing this method, we can observed the crack or solder ball defect call HOP [Head On Pillow] present.
Below are some of the images after the dye penetration test:
