Visual inspection is the process of checking a product’s exterior for defects that might lead to failures, typically focusing on cosmetic issues that could affect functionality. The inspection often follows standards like IPC and JEDEC for ICs, while other products are compared with known good samples. Any abnormalities found are recorded as findings. Most inspections are done under low magnification (5X–60X), but high-powered scopes or SEM may be used for further confirmation. This step is critical, as external defects like lead whiskers causing shorts or corrosion causing electrical failures can significantly impact performance.

Below are images showing defects observed during solderability inspection on the lead side.